SMD
Power Inductors
Two constructions for two priorities — molded inductors are formed in one piece from alloy powder around the coil for good magnetic shielding in a compact body; wire wound inductors are wound on a ferrite core for low DC resistance and high current capability. Together they cover DC-DC power in laptops, mobile devices, panels, hard drives and car audio.
Two constructions, seven sizes
The molded series favours compactness and shielding, the wire wound series favours low DCR and high current — choose by board space and current requirement.
Molded — one-piece alloy powder, well shielded
201610 Series
The most compact package, suited to space-constrained mobile and wearable power modules.
252010 Series
A low-profile version that keeps height down while offering higher rated current.
252012 Series
A taller version with higher saturation current, suited to higher-power DC-DC stages.
Wire Wound — ferrite core, low DCR, high current
6010 Series
The thinnest option, lowest height within the 6 mm footprint.
6012 Series
Widest inductance range in a low-profile body.
6020 Series
Saturation current up to 6.3 A for high-current stages.
6045 Series
Tall version, inductance up to 1500 µH.
| Series | Size L×W×H (mm) | Inductance | Tol. | Part numbers | Rated Temp. | Construction | Datasheet |
|---|---|---|---|---|---|---|---|
| MMD201610T‑□□□M‑DC | 2.0 × 1.6 × 1.0 | 0.24 – 10 µH | ±20% | 10 | −55~+125°C | Molded / Alloy | |
| MMD252010T‑□□□M‑DC | 2.5 × 2.0 × 1.0 | 0.47 – 10 µH | ±20% | 9 | −55~+125°C | Molded / Alloy | |
| MMD252012T‑□□□M‑DC | 2.5 × 2.0 × 1.2 | 0.24 – 10 µH | ±20% | 11 | −55~+125°C | Molded / Alloy |
Cu / Ni / Sn three-layer plated terminals · magnetically shielded one-piece molded construction · see the datasheet for DCR / Isat / Irms per part number.
| Part No. | Inductance | DCR typ / max (Ω) | Isat typ / max (mA) | Irms typ / max (mA) |
|---|---|---|---|---|
| MMD201610T‑R24M‑DC | 0.24 µH | 0.012 / 0.019 | 8000 / 7400 | 6800 / 6200 |
| MMD201610T‑R33M‑DC | 0.33 µH | 0.017 / 0.022 | 7000 / 6500 | 5700 / 5300 |
| MMD201610T‑R47M‑DC | 0.47 µH | 0.022 / 0.025 | 6300 / 5500 | 5500 / 5000 |
| MMD201610T‑R68M‑DC | 0.68 µH | 0.025 / 0.032 | 5200 / 4700 | 4600 / 4300 |
| MMD201610T‑1R0M‑DC | 1.0 µH | 0.035 / 0.043 | 4600 / 4200 | 4500 / 4100 |
| MMD201610T‑1R5M‑DC | 1.5 µH | 0.080 / 0.100 | 3200 / 2900 | 2600 / 2300 |
| MMD201610T‑2R2M‑DC | 2.2 µH | 0.120 / 0.130 | 3000 / 2800 | 2500 / 2100 |
| MMD201610T‑3R3M‑DC | 3.3 µH | 0.140 / 0.170 | 2300 / 2000 | 1700 / 1500 |
| MMD201610T‑4R7M‑DC | 4.7 µH | 0.190 / 0.220 | 2000 / 1800 | 1600 / 1400 |
| MMD201610T‑100M‑DC | 10 µH | 0.480 / 0.580 | 1400 / 1100 | 1000 / 700 |
Isat: current at 30% inductance drop · Irms: current at 40 °C temperature rise · test frequency 1 MHz · MMD252010 and MMD252012 series — click through for the full part lists.
Moritek
2.0×1.6×1.0
1.0 µH
±20%
Molded construction: compact and reliable
Alloy powder and coil are molded together as a single piece — there is no separate core part — giving a closed magnetic path and good shielding, and delivering high saturation current, low flux leakage and excellent temperature-rise behaviour in a small footprint.
One-piece molded construction
Molding the powder and coil together gives a rigid structure with no air-gap noise, and better mechanical strength and environmental durability than assembled cores.
Alloy powder material
The metal alloy powder has high saturation flux density and good DC bias behaviour, so inductance rolls off more gently at high current.
Shielded · low flux leakage
The closed magnetic path reduces interference with neighbouring components, suiting densely laid-out mobile and consumer electronics.
Low impedance · high efficiency
Low DCR cuts conduction loss, improving DC-DC conversion efficiency and helping control overall temperature rise.