Power Inductor Power · Molded Inductor · 2.5 × 2.0 × 1.0 mm

MMD252010 Series

SMD molded alloy power inductor · 0.47 – 10 µH · ±20%
A low-profile version that keeps overall height at 1.0 mm while offering higher rated current.

MMD252010 · MoldedShielded
Moritek MMD252010 molded power inductor
Alloy powder core · Wire-wound · SMD
9
Standard part numbers
0.47 – 10 µH
Inductance range
±20%
Inductance tolerance
−55~+125 °C
Operating temp.
Electrical characteristics

MMD252010 series — complete part list

Inductance measured at 1 MHz. Isat is the saturation current (30% inductance drop); Irms is the temperature-rise current (ΔT 40 °C).

Part No.L (µH)DCR (Ω)Isat (mA)Irms (mA)
Typ.Max.Typ.Max.Typ.Max.
MMD252010T-R47M-DC0.470.0150.0226900650061005600
MMD252010T-R68M-DC0.680.0230.0275900550056005000
MMD252010T-1R0M-DC1.00.0250.0305300480045004100
MMD252010T-1R5M-DC1.50.0450.0554300390034003000
MMD252010T-2R2M-DC2.20.0620.0703300300027002200
MMD252010T-3R3M-DC3.30.0860.1002800250025002100
MMD252010T-4R7M-DC4.70.1600.1802600200020001600
MMD252010T-6R8M-DC6.80.2700.3202400190016001400
MMD252010T-100M-DC100.4950.560155014001050950

±20% tolerance across the series, tested at 1 MHz. Full outline dimensions, land pattern, reflow conditions and packaging are in the datasheet PDF.

Construction

One-piece alloy powder molding

ItemSpecification
Dimensions (L × W × H)2.5 ± 0.2 × 2.0 ± 0.2 × 1.0 Max. mm
CoreAlloy powder
WireEnameled copper wire
TerminalCu / Ni / Sn
Operating temperature−55 ~ +125 °C
StorageBelow 40 °C · humidity < 75%
Applications

Mobile and panel power

LaptopsSmartphonesLCD panelsBluetooth devicesDC-DC conversion